Due to its ultra-thin nature (only 1/10 the diameter of a human hair), 0.006mm double-zero aluminum foil (thickness tolerance ±5%, grain size ≥ Grade 9) is extremely sensitive to non-metallic inclusions in the aluminum matrix. These aluminum-insoluble compound phases disrupt matrix continuity during 12–15 passes of cold rolling (cumulative deformation >99.2%), ultimately forming full-thickness 0.006mm aluminum foil pinholes. Industry data shows that 70% of pinhole defects in 0.006mm aluminum foil caused by raw material issues are directly attributed to non-metallic inclusions, with the equivalent diameter of these pinholes typically ranging from 20–30μm – precisely touching the critical control threshold (≤30μm) for 0.006mm aluminum foil pinholes in food packaging (GB/T 28118-2011) and electronic packaging (GB/T 36363-2018). Therefore, analyzing the types, formation mechanisms of non-metallic inclusions, and their correlation with 0.006mm aluminum foil pinholes is crucial for realizing source control of pinholes in this specific foil grade.
Non-metallic inclusions in aluminum used for 0.006mm foil (Grade 1070/1235, Al ≥99.35%) are categorized into three main types – oxides, carbides, and nitrides (total content ≤0.15%) – with minor sulfides and hydrogen-induced defects (accounting for <5%, negligible impact on 0.006mm aluminum foil pinholes). Each type differs significantly in its mechanism of causing 0.006mm aluminum foil pinholes and the resulting pinhole characteristics:
Oxide inclusions are dominated by α-Al₂O₃ (corundum phase), with small amounts of γ-Al₂O₃ and SiO₂. They are inevitable products of aluminum melt oxidation, and their volume fraction directly determines the density and size of 0.006mm aluminum foil pinholes.
Carbides are primarily Al₄C₃ (hexagonal crystal system), with small amounts of carbon particles from rolling oil. Although their direct contribution to 0.006mm aluminum foil pinholes is lower than oxides, they easily trigger “secondary pinholes” during annealing, disrupting batch stability.
An electronics factory producing 0.006mm aluminum-plastic film substrates for lithium batteries experienced hydrocarbon contamination in the annealing furnace nitrogen (rising to 35ppm), resulting in 12 secondary pinholes/m² in the final product and a 2% electrolyte leakage rate (standard ≤0.1%). XRD testing detected Al₄C₃ characteristic peaks (2θ=33.4°, 38.1°) around the pinholes, while EDS analysis showed 0.8% carbon content on hole walls (normal <0.1%). After replacing the nitrogen purification column (hydrocarbon removal rate ≥99%) and adding vacuum degassing (≤5Pa, 20min), the secondary pinhole rate of 0.006mm aluminum foil decreased to <1%, and the leakage rate was controlled at 0.05%.
Nitrides are mainly AlN (hexagonal crystal system), derived from impure nitrogen or grain refiner induction. Although their contribution is low, they easily cause “linear pinholes” in 0.006mm aluminum foil, impairing mechanical properties.
For 0.006mm aluminum foil pinholes caused by non-metallic inclusions, a “offline precise characterization + online real-time monitoring” system must be established to clarify the correlation between pinholes and inclusions:
Targeting the formation paths of non-metallic inclusions, full-process control from “raw materials – melting – cold rolling – annealing” is required to reduce their impact on 0.006mm aluminum foil pinholes:
Seventy percent of 0.006mm aluminum foil pinholes originate from non-metallic inclusions in the it matrix. Among these, α-Al₂O₃ is the primary inducer (60% contribution), causing clustered and isolated pinholes; Al₄C₃ triggers secondary pinholes (25% contribution), disrupting batch stability; and AlN forms linear pinholes (15% contribution), impairing mechanical properties. Enterprises must adopt a full-process solution including “high-purity raw materials (Al ≥99.7%), melting filtration (removing 5–50μm inclusions), cold rolling temperature control (oil temperature ≤50°C), and annealing degassing (hydrogen ≤0.1mL/100g Al)” to control non-metallic inclusion content below 0.15%. This will reduce the pinhole density of 0.006mm aluminum foil to <5 pinholes/m², meeting quality requirements for food, electronics, and pharmaceutical industries, and enabling breakthroughs in high-end applications (e.g., lithium battery aluminum-plastic films, pharmaceutical PTP foils).